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US Patent Issued to SAMSUNG ELECTRONICS on July 21 for "Display module accounting for ESD phenomenon, and electronic device comprising display module" (South Korean Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,123, issued on July 21, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Display module accounting for ESD phenomenon... Read More


US Patent Issued to ZF Friedrichshafen on July 21 for "High-current element for high-current printed circuit boards" (German, Indian Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,124, issued on July 21, was assigned to ZF Friedrichshafen AG (Friedrichshafen, Germany). "High-current element for high-current printed ci... Read More


US Patent Issued to Mettler-Toledo on July 21 for "Printed circuit board assembly" (Swiss Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,125, issued on July 21, was assigned to Mettler-Toledo GmbH (Greifensee, Switzerland). "Printed circuit board assembly" was invented by Wen... Read More


US Patent Issued to Aptiv Technologies on July 21 for "PCB for an IC chip with D-PHY function and C-PHY function and an PCB assembly including the IC chip" (German Inventor)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,126, issued on July 21, was assigned to Aptiv Technologies AG (Schaffhausen, Switzerland). "PCB for an IC chip with D-PHY function and C-PH... Read More


US Patent Issued to CANON on July 21 for "Printed wiring board, printed circuit board, electronic equipment, and head mounted display" (Japanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,127, issued on July 21, was assigned to CANON K.K. (Tokyo). "Printed wiring board, printed circuit board, electronic equipment, and head mo... Read More


US Patent Issued to SUMITOMO ELECTRIC INDUSTRIES, SUMITOMO ELECTRIC PRINTED CIRCUITS on July 21 for "Substrate for printed circuit board and printed circuit board" (Japanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,128, issued on July 21, was assigned to SUMITOMO ELECTRIC INDUSTRIES LTD. (Osaka, Japan) and SUMITOMO ELECTRIC PRINTED CIRCUITS INC. (Shiga,... Read More


US Patent Issued to NITTO DENKO on July 21 for "Wiring circuit board" (Japanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,129, issued on July 21, was assigned to NITTO DENKO Corp. (Osaka, Japan). "Wiring circuit board" was invented by Hideki Matsui (Osaka, Japa... Read More


US Patent Issued to Kioxia on July 21 for "Semiconductor storage device" (Japanese Inventor)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,130, issued on July 21, was assigned to Kioxia Corp. (Tokyo). "Semiconductor storage device" was invented by Kiyokazu Ishizaki (Tokyo). Ac... Read More


US Patent Issued to Samkee Ev on July 21 for "Flat flexible printed circuit" (South Korean Inventor)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,131, issued on July 21, was assigned to Samkee Ev Co. Ltd. (Seosan-si, South Korea). "Flat flexible printed circuit" was invented by Seung ... Read More


US Patent Issued to Solidigm on July 21 for "Releasable spacer, solid-state drive assembly, and method to manufacture the same" (Canadian, American, Chinese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,132, issued on July 21, was assigned to Solidigm Inc. (Rancho Cordova, Calif.). "Releasable spacer, solid-state drive assembly, and method ... Read More